Event Keynote Speakers: Bestselling Author Dr. Michio Kaku, Texas Instruments CEO Richard Templeton, Better Place Vice President Jason Wolf
SAN FRANCISCO, March 4 /PRNewswire/ — Three electronics industry visionaries will discuss near-term and future opportunities for embedded electronics developers world-wide during their keynote addresses at the EE Times Group’s upcoming ESC Silicon Valley 2010 event, being held at the McEnery Convention Center, San Jose, California, April 26 – April 29.

Keynote Details

Tuesday, April 27, 9:30 AM

Theoretical physicist, best-selling author and science popularizer, Dr. Michio Kaku, will impart a “Star Trek-like” vision of the future where intellectual capital enables many more useful electronics products and systems such as “the smart bathroom” and the “handheld MRI machine.”

Wednesday, April 28, 9:30 AM

Texas Instruments President and Chief Executive Officer, Richard Templeton, will reinforce the role that today’s embedded developers have in bringing life-enriching products to market.

Thursday, April 29, 9:30 AM

Better Place Vice President of North America, Jason Wolf, will explain the impact that electronics innovation has on global energy and transportation ecosystems today and in the future.

“We are very excited to have such accomplished and forward-thinking keynote speakers at this year’s ESC Silicon Valley event,” said EE Times Group’s Director of Content/Media, Rich Nass. “Audiences will be treated to three different but balanced perspectives of the powerful impact that embedded systems developers have on global industries that rely on their inventions, innovations and technologies today, tomorrow and in the decades to come.”

NOTE TO EDITORS: Media registration for ESC Silicon Valley 2010 is now open (https://esc.embedded.com/sv/2010/index/Registrations/Media). Please contact EE Times Group to schedule interviews with exhibiting company executives and speakers before and during the event:

Amy Giannini, Events Marketing Manager

415.947.6626 (office)

925.286.9878 (cell)

amy....@ubm.com

About ESC Silicon Valley (http://esc-sv.techinsightsevents.com)

Held in key strategic technology development locations worldwide, the Embedded Systems Conference is the global electronics industry’s leading event. With cutting edge product demonstrations, visionary speeches and hundreds of essential technical training classes and accreditation opportunities, ESC is the ideal venue for the design engineering community to learn, collaborate and recognize excellence. In addition, ESC Boston celebrates decades of unique local electronics industry culture, innovation and significant contributions to the global technology industry.

About EE Times Group (http://www.eetimesgroup.com/)

EE Times Group, a division of United Business Media (LON: UBM), is the global leader in media and marketing services for the electronics industry. We deliver results for the key influencers and decision makers involved in the design, development and commercialization of technology through our market leading brands. More than 1.1 million engineering professionals engage with the EE Times Network – EE Times, TechOnline, DesignLines, and Embedded.com – across the globe. The technology community comes to our market leading events to share, learn, discuss, and advance the critical issues and challenges facing the electronics industry. As well, EE Times Group provides end-to-end services ranging from next-generation marketing, integrated media and research.

For more information on ESC Silicon Valley 2010 please contact:

Felicia Hamerman

Group Marketing Director, EE Times Group

516.562.5652

feli...@ubm.com

Media Contact:

Lynda Kaye

Kaye Public Relations

650.799.2888

lyn...@KayePR.com

Numonyx 65nm serial flash for embedded applications
Numonyx has introduced its 65nm multiple I/O serial flash memory product line designed for embedded applications. The new Numonyx Forte N25Q serial flash family is available in 3V and 1.8V.

The N25Q serial flash memory supports multiple I/O SPI protocols (Single, Dual and Quad,) on the same device, which delivers the highest level of design flexibility to customers.

Numonyx said it has significantly improved the read and write speeds over the entire supply voltage range, improving clock speeds from 75MHz to 108MHz and up to four times, or 432MHz, in the Quad I/O mode. At both 3V and 1.8V, the N25Q is well-suited for a range of applications, including battery-operated devices such as handheld or consumer electronics.

If the goal of the GSM Association comes to fruition, there will be 50 billion connected devices on the market by 2025, meaning that every individual could have approximately seven connected devices. That also means seven new revenue streams coming into the service providers who stake a claim in the movement, which is beginning to reach all industries from healthcare to transport to clean energy, education, consumer electronics and smart utilities. In an effort to drive volumes up and prices down, the GSMA launched a competition last week encouraging the production of standardized 3G modules in a range of consumer electronics devices. GSMA chief marketing officer Michael O’Hara spoke with Telephony about the GSMA’s Embedded Mobile initiative, launched last year, and the potential for service providers to move beyond voice and into devices everywhere.

On the networks’ evolution: When I came in [a year ago], we were focused on the mobile broadband space and the battle between HSPA, LTE and the WiMax camp. That was a valid technology debate a year ago; people were trying to look at what would win; what would be the best way to do mobile broadband going forward. We got to a point where that is pretty much over. We are now sitting around 315 HSPA networks across 127 countries. There are about 133 million HSPA subscribers out there now. It is certainly fast growing and will become the ubiquitous mobile broadband technology going forward. We still see WiMax as complementary in some emerging markets, but as a mainstream technology, we’re pretty much set on HSPA and the evolution into LTE. As that rolls out, we have 3G phones; we’ve seen the emergence of 3G laptops over the next year and operators starting to sell netbooks. The next step is embedding the mobile broadband technology in every device.

On the target verticals: There is definitely the potential to embed the technology in a number of areas. Obviously with consumer electronics where you start to look at connected cameras, MP3 players – all that fun stuff. The utility markets have always been big with smart metering, the ability to charge people differently depending on the time of day. It is interesting around performance information from cars and monitoring how cars are going along, health care, patient monitoring and well-being monitoring. Clean energy is a becoming a big thing around reporting emissions and air quality. Those are a number of verticals where you are starting to see this technology move and probably the target verticals for us.

WASHINGTON: Pradeep Khosla, an Indian-American internationally recognised as an authority on robotics, has been selected to join a prestigious council, committed to US competitiveness in the global economy.

Khosla, an IIT Kharagpur alumnus has been selected to join the Council on Competitiveness — a select group of corporate CEOs, university presidents and labour leaders to evaluate economic challenges and guide American competitiveness in this globalised world.

“An internationally recognised authority on robotics, embedded systems, technology education, innovation and cybersecurity, Carnegie Mellon’s Pradeep K Khosla is an outstanding addition to our newly formed Technology Leadership Strategy Initiative,” said Deborah Wince-Smith, president of the Washington, DC-based council.

He was also recently appointed for a second five year term as dean of the prestigious Carnegie Institute of technology, in recognition of his leadership in research and education initiatives both within the university and internationally.

He will join an elite group of academic researchers and business leaders tapped to serve for the next three years on the Technology Leadership Strategy Initiative (TLSI), a collaborative effort designed to chart the most promising frontiers of technology and competitive advantage arenas for the United States.

The council estimates that technology jobs are growing five times faster than any other jobs worldwide, and 90 per cent of the fastest-growing jobs in America require post-secondary education. Khosla is founding director of Carnegie Mellon CyLab, one of the largest university-based cybersecurity research and education centers in the world.

The new initiative will be co-chaired by Ray Johnson, senior vice president and chief technology officer for Lockheed Martin Corp, and Mark Little, senior vice president and director of GE Global Research.

Among the areas examined in this report are the technology, architecture and packaging trends affecting the industry, as well as a thorough discussion of new and emerging technologies and materials, potential threats and the latest regulatory developments and standards. Over 25 tables, graphs and illustrations are presented depicting a variety of power system schematics and comparisons, architectural standards, product introductions, packaging solutions, efficiency standards and other relevant information. The focus of this comprehensive analysis provides decision makers with an insightful look into the current and future opportunities and threats available in theembedded ac-dc power supply market.

Over the next few years, ac-dc power supplies will represent a faster growth opportunity than board-mounted dc-dc converter modules. This is a major development and marks a significant departure from past patterns. Historically, power converter makers have turned to dc-dc converter modules for high growth rates. That will no longer be possible. As a result of numerous factors, ac-dc power supplies now represent a better long-term growth opportunity than dc-dc converter modules (see Graphs 1-3). Despite a global economic slowdown, the outlook for the worldwide embedded ac-dc power supply market is expected to remain strong. Evolving powering architectures, packaging trends, and global standards for improvements in energy efficiency are combining with developments in advanced components and new markets for ac-dc power and to create new opportunities for makers of ac-dc power supplies.

The emergence of LED lighting as a major application area is another instance where single-output power supplies will have a strong positive impact on the market. More and more often, high-power LEDs are leaving their niche in small displays and are used in mainstream lighting applications requiring power levels of 100W or greater. At the same time, demand for lower-wattage LED power supplies will also remain strong. Given this increasing demand for LED lighting applications, a growing number of companies are introducing ac-dc power supplies designed exclusively for high-brightness LED lighting applications. In addition, there are a number of new and important packaging trends and applications moving into the market. The growing influence of the Advanced Telecommunications Computing Architecture (ATCA), which is targeted at the requirements for the next generation of carrier-grade communications equipment including telecom and data systems centers, is especially important. The ATCA architecture provides high levels of availability via redundancy and hot swapping techniques, which will provide a host of opportunities for embedded ac-dc power supplies.